ITW Devcon® 11480 30 lb. Bucket High Temperature Putty, Epoxy, Gray
ITW Devcon® High Temperature Putty, 120 min. Wire Life, Applications: For Ceramic Bead-Filled Epoxy System For Maximum Wear and Abrasion Resistance in Processing Equipment, Characteristics: High-Temperature, High-Density, Heat-Cured, Trowelable, Provides 30% Better Abrasion Resistance than Conventional Wear Compounds, High Resistance to Acids, Bases, Salts and Solvents, Adheres to Metal, Ceramic and Concrete, Gray, Epoxy Compound, Size: 30 lb., 13200 psi Compressive Strength, Bucket, Full Cure: Heat Cure, Functional Cure: 120 min., Includes: Resin and Hardener, 6:1 Mixing Ratio, 450°F Maximum Temperature, Primer: No, 2300 psi Shear Strength, Up to 450°F Temperature, 4600 psi Tensile Strength, Viscosity: Non-Sag Putty
- Heat-cured, trowelable system that gives up to 30% improvement over conventional wear compounds
- Unmatched resistances to many acids, bases, salts, and solvents
- Excellent abrasion resistance to all sizes of materials and particulate in high heat applications such as exhausters, pulverizers, and cyclones