Scotch-Weld™ 3797 Hot Melt Adhesive, 1 in dia x 3 in L, -20 to 290 deg F, 30 sec Application, 24 hr Curing
Item #BC406979
Scotch-Weld™ Hot Melt Adhesive, 1 in Dia, 3 in Length, -20 to 290 deg F, 30 sec Application, 24 hr Curing, 10 psi Peal Strength, 350 psi Shear Strength, 283 psi Tensile, Thermoplastic Resin, Off-White
- Hot melt adhesive ideal for potting of electrical and electronic components
- Low viscosity provides high flow rates for excellent coverage
- Ball and ring tested - adhesive exhibits good temperature resistance after application
- 30 sec bead open time makes for effective potting at depth
- Dispensed with 3M™ Scotch-Weld™ hot melt applicator PG II
- Short open time
- PG size
- 100% solids weight
- Material compatibility with acrylics and polyolefin
- 24 months shelf-life